Today’s advanced electronics require higher power levels and larger heat removal from the denser chip packaging. Typical printed circuit technology will not disperse enough heat to satisfy these newer designs nor does it have low enough CTE numbers to properly place higher count BGA without reliability problems. Advanced metal cores, as well as higher thermal conductivity laminates, combined with new ideas, can obtain the thermal conductivity that you desire with the CTE numbers needed.
New microelectronics is packing more density than ever into a smaller package, resulting in higher heat densities and creating new heat related problems. Metal core high thermal conductivity chip packaging advances allow higher output designs to run cooler.
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