Put real 0201 and 0402 components inside a circuit board. The new bleeding edge technology facilitates the embedding of small components such as resistors, capacitors, discreet chips and even inductors right in the middle of a multilayer. The technology is proven and may require a minimal investment in equipment ad materials. Be one of the first to offer this extremely high density packaging Idea. The market is ready and willing for this new high density advancement.
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